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    <identifier>10.57760/sciencedb.13250</identifier>
    <datestamp>2024-09-12T09:52:17Z</datestamp>
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  <dc:date>2024-09-12</dc:date>
  <dc:title>Effect of holmium oxide nanoparticle on the mechanical properties of epoxy resin composites</dc:title>
  <dc:identifier>doi:10.57760/sciencedb.13250</dc:identifier>
  <dc:language>en</dc:language>
  <dc:description> The materials used were commercially available bisphenol Aepoxyresin of type E51 (Yehao Co.Ltd, WX, China), JD 365curing agent (MYChemicalCo.Ltd,China)withafixed &amp;nbsp;ratio to resin ranging from 1:3 to 1:4, holmium oxide (LS &amp;nbsp;Co.Ltd, TJ, China), and silane coupling agent (SCA) of type &amp;nbsp;KH550 (CSJ Co. Ltd, NJ, China) The preparation pro cess is shown in Figure 1.TheHo2O3/EP nanocomposites with &amp;nbsp;different contents of Ho2O3 (0,0.5,1,1.5wt.%)wereprepared &amp;nbsp;for comparison experiments. Firstly, a certain amount of ac etone was mixed with epoxy resin, and then a certain amount of &amp;nbsp;Ho2O3 particles were added and dispersed under the combined &amp;nbsp;effect of ultrasonication and mechanical stirring for 2-4 h, after &amp;nbsp;removing the excess acetone, the curing agent was added and &amp;nbsp;stirred mechanically for 0.5 h, and then the mixtures were &amp;nbsp;placed in a vacuum drying oven to remove air bubbles and &amp;nbsp;poured into the mold, and the total curing process was about 5 h &amp;nbsp;after two steps, and then the specimens were removed from the &amp;nbsp;mold and were cooled to room temperature.</dc:description>
  <dc:subject>Composites; epoxy resin; mechanical property; Ho2O3 nanoparticle; surface-modification; fracture morphology</dc:subject>
  <dc:creator>Bo Wang</dc:creator>
  <dc:creator>Xinjing Liu</dc:creator>
  <dc:creator>Zhiwu Han</dc:creator>
  <dc:rights>RESTRICTED</dc:rights>
  <dc:type>dataset</dc:type>
  <dc:relation>http://www.doi.org/10.1177/07316844241255269</dc:relation>
  <dc:publisher>Science Data Bank</dc:publisher>
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