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    <responseDate>2026-10-15T01:02:40Z</responseDate>
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    <identifier>10.57760/sciencedb.29527</identifier>
    <datestamp>2026-03-13T15:58:20Z</datestamp>
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<oai_dc:dc xmlns:oai_dc="http://www.openarchives.org/OAI/2.0/oai_dc/" xmlns:dc="http://purl.org/dc/elements/1.1/" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xsi:schemaLocation="http://www.openarchives.org/OAI/2.0/oai_dc/ http://www.openarchives.org/OAI/2.0/oai_dc.xsd">
  <dc:date>2026-03-13</dc:date>
  <dc:title>ECT-Mat: An Experimental Mutual Capacitance Dataset for Material Sensing and Inverse Problem Benchmarking</dc:title>
  <dc:identifier>doi:10.57760/sciencedb.29527</dc:identifier>
  <dc:language>en</dc:language>
  <dc:description>We introduce ECT-Bench, the ffrst large-scale, experimentally acquired dataset for planar Electrical Capacitance Tomography (ECT) designed to evaluate both imaging and dynamic tracking algorithms. The dataset contains 54,739 high-resolution mutual capacitance matrices acquired via a custom 3&amp;times;3 electrode array. Taking advantage of a uniffed robotic pipeline, data was collected under comprehensive spatial variables, covering contact and multi-distance non-contact conditions (Z-axis permutations), alongside continuous spatio-temporal trajectories. Three representative materials (glass, resin, wood) and geometric shapes (circle, triangle, square) are thoroughly documented. Each sample couples raw capacitance signals with strict positional metadata and ground-truth object labels. Furthermore, ECT-Bench provides quantitative reconstructions comparing traditional physical solvers (Linear Back Projection, Landweber) against data-driven deep learning (CNNs). Unlike existing simulation-based benchmarks, ECT-Bench captures genuine soft-ffeld characteristics, dielectric variability, positional uncertainty, and hardware noise. By openly releasing all sensor fabrication ffles, acquisition codes, and baselines, ECT-Bench establishes a standardized, rigorous foundation for bridging the gap between numerics and practical real-world touchless sensing.&amp;nbsp;</dc:description>
  <dc:subject>Electrical Capacitance Tomography; touchless  material sensing; inverse problem research; Material recognition</dc:subject>
  <dc:creator>Duanpeng Shi</dc:creator>
  <dc:creator>Yuliang Wang</dc:creator>
  <dc:creator>Xu Li</dc:creator>
  <dc:creator>Tengchen Sun</dc:creator>
  <dc:creator>Huaping Liu</dc:creator>
  <dc:creator>Di Guo</dc:creator>
  <dc:rights>PUBLIC</dc:rights>
  <dc:rights>https://creativecommons.org/licenses/by/4.0/</dc:rights>
  <dc:type>dataset</dc:type>
  <dc:publisher>Science Data Bank</dc:publisher>
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