2026-10-14T22:07:54Z https://www.scidb.cn/oai

10.57760/sciencedb.42514 2026-07-13T09:49:33Z

2026-07-13 The thermal and vibration simulation data as well as the reliability test results of the two types of configuration chips doi:10.57760/sciencedb.42514 en The thermal stress simulation and vibration simulation for both the straight-pin and bent-pin configurations of the chip were completed using ANSYS 2023 software, and the data results were obtained. These results need to be opened using ANSYS 2023 software or a higher version of ANSYS software. Five hundred cycles of reliability tests were conducted on the control groups of the three reliability tests, providing data on the crack conditions of the solder joints for each test control group before the test, after the 150th cycle, after the 400th cycle, and after the 500th cycle. thermal simulation; Vibration simulation; reliability test Peng Xinqian PUBLIC https://creativecommons.org/licenses/by-nc-nd/4.0/ dataset Science Data Bank